Reducing dark current in germanium photodiodes by electrical over-stress

ABSTRACT

Methods and systems for reducing dark current in a photodiode include heating a photodiode above room temperature. A reverse bias voltage is applied to the heated photodiode to reduce a dark current generated by the photodiode.

BACKGROUND Technical Field

The present invention relates to semiconductor devices and, moreparticularly, to reducing dark current in germanium photodiodes.

Description of the Related Art

A photodiode is a semiconductor device that converts incoming light intoan electrical current. As the photodiode absorbs incoming photons, theenergy is converted to electrical energy that can be used for signalingor power generation. Semiconductor-based photodiodes are used in avariety of applications, including, for example, optical switching inphotonic circuits, receiving signals in fiber optic communicationsystems, etc.

The material used to fabricate the photodiode dictates its propertiesand, in particular, the region of the electromagnetic spectrum to whichthe photodiodes sensitive. Photodiodes can, for example, be fabricatedby depositing germanium diodes on a silicon substrate, providingsensitivity to longer wavelengths than would be accessible to siliconphotodiodes. However, the resulting germanium-on-silicon diodes exhibita high “dark current,” which is the current generated by the device whenthe device is not illuminated. In some cases, the dark current can be inexcess of hundreds of nanoamps. Dark current may result from backgroundradiation and the saturation current of the semiconductor junctionforming the diode. One possible cause of the high dark current is a highdefect density that results from the large lattice constant differencebetween the silicon and germanium layers. The shot noise from the highdark current reduces the signal-to-noise ratio of the photodetector,making it more difficult to capture faint signals. The variable natureof the dark current over temperature and between devices preventsaccurate monitoring of the received optical signal level.

SUMMARY

A method for reducing dark current in a photodiode includes heating aphotodiode above room temperature. A reverse bias voltage is applied tothe heated photodiode to reduce a dark current generated by thephotodiode.

A method for reducing dark current in a photodiode includes heating agermanium photodiode, formed on a silicon substrate, above roomtemperature. A reverse bias voltage is applied to the heated photodiodeto reduce a dark current generated by the photodiode. The dark currentgenerated by the photodiode is measured. The reverse bias voltage isincreased until the measured dark current stabilizes to maximize a darkcurrent reduction after the photodiode returns to room temperature.

A system for reducing dark current in a photodiode includes a heaterconfigured to heat a photodiode above room temperature. A reverse biasvoltage source is configured to apply a reverse bias voltage to theheated photodiode to reduce a dark current generated by the photodiode.

These and other features and advantages will become apparent from thefollowing detailed description of illustrative embodiments thereof,which is to be read in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The disclosure will provide details in the following description ofpreferred embodiments with reference to the following figures wherein:

FIG. 1 is a diagram of a system for reducing dark current for aphotodiode in accordance with the present principles;

FIG. 2 is a diagram of a photodiode in accordance with the presentprinciples;

FIG. 3 is a diagram of a system for reducing stable dark current for aphotodiode in accordance with the present principles;

FIG. 4 is a block/flow diagram of a method for reducing stable darkcurrent for a photodiode in accordance with the present principles;

FIG. 5 is a block/flow diagram of a method for reducing stable darkcurrent for a photodiode in accordance with the present principles;

FIG. 6 is a block diagram of a control system for reducing stable darkcurrent for a photodiode in accordance with the present principles; and

FIG. 7 is a block diagram of a control system for reducing stable darkcurrent for a photodiode in accordance with the present principles.

DETAILED DESCRIPTION

Embodiments of the present invention reduce dark current in photodiodesby applying a reverse voltage bias and by controlling the temperature ofthe photodiodes. This has been shown to reduce dark current by up to30%, substantially decreasing the noise in the photodiode.

Referring now to the drawings in which like numerals represent the sameor similar elements and initially to FIG. 1, an exemplary circuitdiagram of the present embodiment is shown. A photodiode 102 is shownfeeding into an optical receiver 104. As incident light strikes thephotodiode 102, the photodiode 102 produces an electrical current thatis detected by the optical receiver 104 and used to, for example,demodulate and decode a communications signal sent over a fiber opticline.

In one particular embodiment, it is contemplated that the photodiode 102may be formed from germanium deposited on a silicon substrate but, asdescribed below, it should be understood that other materials may beused instead. The photodiode 102 produces some amount of dark currenteven when the device is not illuminated, raising the noise floor of anyreceived signal.

To address this problem, a voltage source 106 is applied to thephotodiode 102 to reverse bias the photodiode 102. When applied atambient temperatures during operation of the photodiode 102, as shown inFIG. 1, an initial application of a high reverse stress voltage (e.g.,about −3.3V for at least a second) results in a reduction in darkcurrent of about 25%. In general, the dark current reduction ismaintained until the temperature of the photodiode 102 increasessignificantly above the temperature at which the reverse stress voltagewas applied.

The voltage supplied by voltage source 106 may be a constant voltage ormay, alternatively be a ramp or stepped voltage following anyappropriate voltage ramping curve. In some cases, a ramping or steppingvoltage stress can reach maximum reduction more quickly and accuratelyby ramping or stepping the voltage until the dark current reaches aminimum level. In such an embodiment, the dark current may be monitoredduring application of the reverse bias in a feedback loop using darkcurrent sensor 108. The measurement may then be used to determine thestrength of the voltage source 106 as described in detail below.

Referring now to FIG. 2, detail on the structure of a photodiode 102 isshown. A semiconductor-on-insulator substrate is shown, with a buriedinsulator layer 202 and a semiconductor layer 204. In anotherembodiment, a bulk semiconductor substrate may be used instead, omittingthe buried insulator layer 202. It should be recognized that anyappropriate materials can be used to form the substrate. In oneparticular embodiment, it is contemplated that the buried insulatorlayer 202 may be formed from silicon dioxide and that the semiconductorlayer 204 may be formed from crystalline silicon. Alternative materialsfor the semiconductor layer 204 include, for example, silicon germanium,silicon germanium carbide, silicon carbide, polysilicon, amorphoussilicon, germanium, gallium arsenide, gallium nitride, cadmiumtelluride, zinc sellenide, etc. Alternative materials for the insulatorlayer 202 include, for example, silicon nitrides, sapphire, aluminumnitride, boron nitride, beryllium, nitride, etc.

A nitride layer 205 is formed over the semiconductor layer 204. It isspecifically contemplated that the nitride layer 205 may be formed fromsilicon nitride, but any appropriate insulating material may be usedinstead. The nitride layer 205 forms an insulating barrier between thesemiconductor layer 204 and a diode semiconductor layer 208. In oneembodiment, the diode semiconductor layer 208 is formed from a differentsemiconductor material than the substrate semiconductor layer 204, withgermanium being specifically contemplated. The diode semiconductor layer208 is encapsulated by a nitride layer 206 that may be formed from thesame material as the nitride layer 205 (e.g., silicon nitride) or mayalternatively be formed from a different insulating material.

The diode semiconductor layer 206 is doped and has three regions—ann-type doped region 210, an intrinsic region 212, and a p-type dopedregion. Although not shown in this figure, electrical contacts may beform through the encapsulating nitride layer 206 to contact the n-typeregion 210 and the p-type region 214. Exemplary n-type dopants for agroup IV semiconductor include phosphorus, arsenic and antimony.Exemplary p-type dopants for a group IV semiconductor include boron,aluminum, and gallium. The concentration of dopant within the dopedregion is typically from about 1011 to about 1015 atoms/cm2, with aconcentration of dopant within the doped region from about 1011 to about1013 atoms/cm2 being more typical.

In this particular embodiment, a portion of the diode semiconductorlayer 208 comes into contact with the substrate semiconductor layer 204through a hole in the nitride layer 205. This contact point may be usedduring formation to establish a crystalline seeding point, such that thediode semiconductor layer 208 may be a single, monocrystallinestructure.

It is to be understood that the present invention will be described interms of a given illustrative architecture having substrates andphotovoltaic stacks; however, other architectures, structures,substrates, materials and process features and steps may be variedwithin the scope of the present invention.

It will also be understood that when an element such as a layer, regionor substrate is referred to as being “on” or “over” another element, itcan be directly on the other element or intervening elements may also bepresent. In contrast, when an element is referred to as being “directlyon” or “directly over” another element, there are no interveningelements present. It will also be understood that when an element isreferred to as being “connected” or “coupled” to another element, it canbe directly connected or coupled to the other element or interveningelements may be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present.

A design for a photovoltaic device may be created for integrated circuitintegration or may be combined with components on a printed circuitboard. The circuit board may be embodied in a graphical computerprogramming language, and stored in a computer storage medium (such as adisk, tape, physical hard drive, or virtual hard drive such as in astorage access network). If the designer does not fabricate chips or thephotolithographic masks used to fabricate chips or photovoltaic devices,the designer may transmit the resulting design by physical means (e.g.,by providing a copy of the storage medium storing the design) orelectronically (e.g., through the Internet) to such entities, directlyor indirectly. The stored design is then converted into the appropriateformat (e.g., GDSII) for the fabrication of photolithographic masks,which typically include multiple copies of the chip design in questionthat are to be formed on a wafer. The photolithographic masks areutilized to define areas of the wafer (and/or the layers thereon) to beetched or otherwise processed.

Methods as described herein may be used in the fabrication ofphotovoltaic devices and/or integrated circuit chips with photovoltaicdevices. The resulting devices/chips can be distributed by thefabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged devices/chips), as a bare die, or in a packagedform. In the latter case the device/chip is mounted in a single chippackage (such as a plastic carrier, with leads that are affixed to amotherboard or other higher level carrier) or in a multichip package(such as a ceramic carrier that has either or both surfaceinterconnections or buried interconnections). In any case, thedevices/chips are then integrated with other chips, discrete circuitelements, and/or other signal processing devices as part of either (a)an intermediate product, such as a motherboard, or (b) an end product.The end product can be any product that includes integrated circuitchips, ranging from toys, energy collectors, solar devices and otherapplications including computer products or devices having a display, akeyboard or other input device, and a central processor. Thephotovoltaic devices described herein are particularly useful for solarcells or panels employed to provide power to electronic devices, homes,buildings, vehicles, etc.

It should also be understood that material compounds will be describedin terms of listed elements, e.g., GaInP, InGaAs or SiGe. Thesecompounds include different proportions of the elements within thecompound, e.g., InGaAs includes In_(x),Ga_(y)As_(1-x-y), where x, y areless than or equal to 1, or SiGe includes Si_(x)Ge_(1-x), where x isless than or equal to 1, etc. In addition, other elements may beincluded in the compound, such as, e.g., AlInGaAs, and still function inaccordance with the present principles. The compounds with additionalelements will be referred to herein as alloys.

The present embodiments may be part of a photovoltaic device or circuit,and the circuits as described herein may be part of a design for anintegrated circuit chip, a solar cell, a light sensitive device, etc.The photovoltaic device may be a large scale device on the order of feetor meters in length and/or width, or may be a small scale device for usein calculators, solar powered lights, etc.

It is also to be understood that the present invention will be describedin terms of a particular tandem (multi-junction) structure; however,other architectures, structures, substrate materials and processfeatures and steps may be varied within the scope of the presentinvention. The tandem structure includes cells, which will be describedin terms of a particular material. Each cell includes a p-doped layer,an n-doped layer and perhaps an undoped intrinsic layer. For the presentdescription, the n-doped layer and p-doped layers will be formed eitherfrom a same base material that is doped to provide an n-type portion anda p-type portion or from two different base materials so that a firstmaterial is doped to provide the n-type portion and the second materialis doped to provide the p-type portion. For simplicity, each cell layerwill be described in terms of the base layer material. The n-doped andp-doped regions are preferably formed by doping during epitaxial growth.Other doping methods may also be employed. While intrinsic layers may beformed between the n-type and p-type layers, e.g., very thin intrinsiclayers inserted intentionally between an emitter and a base to mitigateintermixing of the dopants at a junction, the intrinsic layers, ifneeded, are not depicted in the drawings for simplicity.

The present embodiments may be part of a photovoltaic device or circuit,and the circuits as described herein may be part of a design for anintegrated circuit chip, a solar cell, a light sensitive device, etc.

It is also to be understood that the present invention will be describedin terms of a given illustrative architecture having a particular tandem(multijunction) structure; however, other architectures, structures,substrate materials and process features and steps may be varied withinthe scope of the present invention. The tandem structure includes cells,which will be described in terms of a particular material. While eachcell includes a p-doped layer, an n-doped layer and perhaps an undopedintrinsic layer, the n-doped layer and p-doped layers will be omittedfrom the FIGS. and the description for ease of explanation. Instead, forsimplicity, each cell layer will be described in terms of a base layermaterial and a band gap associated with the base layer. The n-doped andp-doped regions may be formed by doping during epitaxial growth or dopedafter formation by any known implantation or diffusion process.

Reference in the specification to “one embodiment” or “an embodiment” ofthe present principles, as well as other variations thereof, means thata particular feature, structure, characteristic, and so forth describedin connection with the embodiment is included in at least one embodimentof the present principles. Thus, the appearances of the phrase “in oneembodiment” or “in an embodiment”, as well any other variations,appearing in various places throughout the specification are notnecessarily all referring to the same embodiment.

It is to be appreciated that the use of any of the following “/”,“and/or”, and “at least one of”, for example, in the cases of “A/B”, “Aand/or B” and “at least one of A and B”, is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of both options (A andB). As a further example, in the cases of “A, B, and/or C” and “at leastone of A, B, and C”, such phrasing is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of the third listedoption (C) only, or the selection of the first and the second listedoptions (A and B) only, or the selection of the first and third listedoptions (A and C) only, or the selection of the second and third listedoptions (B and C) only, or the selection of all three options (A and Band C). This may be extended, as readily apparent by one of ordinaryskill in this and related arts, for as many items listed.

While the above-described dark current reduction is possible to triggerat runtime, the present embodiments furthermore provide a process tolock-in the dark current reduction. This is accomplished by applying areverse bias voltage during an anneal. An anneal is commonly used afterdevice fabrication, prior to shipping the device, to test the device forreliability.

Referring now to FIG. 3, a system for permanently reducing the darkcurrent of a photodiode 102 is shown. After fabrication, the photodiode102 is placed into, e.g., an oven 302 with a heater 304. As noted above,the heater 304 may increase the ambient temperature of the air insidethe oven 302 or, alternatively, may apply heat to the photodiode 102more directly, for example through a heater on the chuck holding thephotodiode 102 or through an on-chip heater. The heater 304 increasedthe temperature to a level at or above an intended maximum operatingtemperature of the photodiode 102.

During application of heat, for example during a burn-in reliabilityanneal, a voltage source 306 is connected to the photodiode 102 to applya reverse bias voltage to the photodiode 102. Applying the reverse biasvoltage at a high temperature during the anneal locks the dark currentreduction, such that the dark current is permanently reduced as long asthe temperature of the photodiode 102 does not increase above the annealtemperature.

The reverse bias voltage source 306 may be a constant voltage or, asdescribed in more detail below, may be ramped to find an optimal reversebias voltage for dark current reduction. Toward that end, a dark currentsensor 308 may be connected to the photodiode 102 to measure the darkcurrent, while a control system 310 determines the effect of differentreverse voltage bias values on the dark current and adjusts the outputof the reverse bias voltage source 306 accordingly.

Referring now to FIG. 4, a method for reducing dark current in aphotodiode 102 is shown. Block 402 heats the photodiode 102 using heater304 which may produce, for example, an increase in the ambienttemperature, an increase in chunk temperature, or an increase intemperature of an on-chip heater. Block 404 then applies a constantreverse voltage to the photodiode 102 using the voltage source 306.

Heating the photodiode 102, for example during part of the anneal, whileapplying the reverse bias voltage can result in stable dark currentreductions that remain even after the bias is removed. In one test,where a reverse bias of about −2.7V was applied without additional heat(e.g., at room temperature), a reduction of dark current of about20%-30% was measured as compared to the dark current generated by adevice that had no reverse bias voltage applied, but this reductiondiminished to 5% after the reverse bias voltage was removed and asubsequent anneal was applied that raised the temperature of thephotodiode above room temperature. In a second test, where a reversebias voltage of about −2.4V was applied for ten hours at 175° C.followed by a fifty hour anneal at 175° C. without a reverse bias, adark current reduction of about 15%-20% was maintained even after theanneal.

Referring now to FIG. 5, an alternative method for reducing dark currentin a photodiode is shown. Block 502 heats the photodiode 102 using theheater 304. Block 503 makes an initial measurement of the dark currentat an operational voltage. Block 504 then applies an initial reversebias voltage to the photodiode 102 using the voltage source 306. Block506 measures the dark current at the operational voltage using a darkcurrent sensor 308. Block 508 plots the reduction of the dark current asa function of the reverse bias voltage, noting the rate of decrease ofthe dark current. It should be recognized that any appropriate form ofcomparison between data points may be used in block 508 as analternative to plotting the points.

Block 510 determines whether the dark current reduction is at a maximum(e.g., by comparing a set of dark current measurements to determinewhether they continue to decrease). If the maximum reduction has notbeen reached, processing returns to block 506 to increase the reversebias voltage for the photodiode 102 for another dark currentmeasurement.

If the maximum reduction has been reached, block 512 removes the reversebias voltage. The anneal may continue after this point, but the darkcurrent reduction will be maintained as long as the temperature of thephotodiode 102 does not exceed the temperature during the application ofthe reverse bias voltage. In one example, with an anneal at 175° C. forsixty hours, the reverse bias voltage may be applied for ten hours toachieve a stable 20% reduction in dark current.

Referring now to FIG. 6, detail on the control system 310 is shown. Thecontrol system 310 includes a hardware processor 602 and memory 604. Inaddition, the control system 310 includes multiple functional modules toperform certain roles in the system. In one embodiment, these modulesmay be implemented as software that is stored in memory 604 and executedon the hardware processor 602. In an alternative embodiment, the modulesmay be implemented as one or more special-purpose hardware components inthe form of, for example, application specific integrated chips or fieldprogrammable gate arrays.

A current sensor module 606 interfaces with the dark current sensor 308to determine the amount of dark current being generated by thephotodiode 102. The current sensor module 606 therefore includes aphysical interface to the dark current sensor 308 and, in oneembodiment, may include the dark current sensor 308 itself. The currentsensor module 606 stores dark current measurements in the memory 604.

A voltage control module 608 sets a voltage of the reverse bias voltagesource 306. The voltage control module 608 therefore includes a physicalinterface to the reverse bias voltage source 306 and, in one embodiment,may include the reverse bias voltage source 306 itself. In addition, thevoltage control module 608 accesses dark current measurements taken bythe current sensor module 606 and correlates those measurements withrespective voltage levels. Based on the correlation between dark currentmeasurements and voltage levels, the voltage control module 608 mayincrease the voltage level of the reverse bias voltage source 306.Alternatively, the voltage control module 608 may use a constant voltagelevel. The voltage control module 608 also controls the amount of timethat the reverse bias voltage source 306 operates. In one embodiment,the voltage control module 608 turns off the reverse bias voltage source306 after ten hours.

A heater control module 610 interfaces with 304 to control thetemperature of the photodiode 102. The heater control module 610 maymaintain a constant temperature for an anneal or may, alternatively,vary the temperature over time. In one exemplary embodiment it isspecifically contemplated that the heater control module 610 maintains aconstant temperature of about 175° C. for up to about 20 hours.

The present invention may be a system, a method, and/or a computerprogram product. The computer program product may include a computerreadable storage medium (or media) having computer readable programinstructions thereon for causing a processor to carry out aspects of thepresent invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, or either source code or object code written in anycombination of one or more programming languages, including an objectoriented programming language such as Smalltalk, C++ or the like, andconventional procedural programming languages, such as the “C”programming language or similar programming languages. The computerreadable program instructions may execute entirely on the user'scomputer, partly on the user's computer, as a stand-alone softwarepackage, partly on the user's computer and partly on a remote computeror entirely on the remote computer or server. In the latter scenario,the remote computer may be connected to the user's computer through anytype of network, including a local area network (LAN) or a wide areanetwork (WAN), or the connection may be made to an external computer(for example, through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example,programmable logic circuitry, field-programmable gate arrays (FPGA), orprogrammable logic arrays (PLA) may execute the computer readableprogram instructions by utilizing state information of the computerreadable program instructions to personalize the electronic circuitry,in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the block may occur out of theorder noted in the figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

Referring now to FIG. 7, an exemplary processing system 700 is shownwhich may represent the transmitting device 100 or the receiving device120. The processing system 700 includes at least one processor (CPU) 704operatively coupled to other components via a system bus 702. A cache706, a Read Only Memory (ROM) 708, a Random Access Memory (RAM) 710, aninput/output (I/O) adapter 720, a sound adapter 730, a network adapter740, a user interface adapter 770, and a display adapter 760, areoperatively coupled to the system bus 702.

A first storage device 722 and a second storage device 724 areoperatively coupled to system bus 702 by the I/O adapter 720. Thestorage devices 722 and 724 can be any of a disk storage device (e.g., amagnetic or optical disk storage device), a solid state magnetic device,and so forth. The storage devices 722 and 724 can be the same type ofstorage device or different types of storage devices.

A speaker 732 is operatively coupled to system bus 702 by the soundadapter 730. A transceiver 742 is operatively coupled to system bus 702by network adapter 740. A display device 762 is operatively coupled tosystem bus 702 by display adapter 760.

A first user input device 752, a second user input device 754, and athird user input device 756 are operatively coupled to system bus 702 byuser interface adapter 750. The user input devices 752, 754, and 756 canbe any of a keyboard, a mouse, a keypad, an image capture device, amotion sensing device, a microphone, a device incorporating thefunctionality of at least two of the preceding devices, and so forth. Ofcourse, other types of input devices can also be used, while maintainingthe spirit of the present principles. The user input devices 752, 754,and 756 can be the same type of user input device or different types ofuser input devices. The user input devices 752, 754, and 756 are used toinput and output information to and from system 700.

Of course, the processing system 700 may also include other elements(not shown), as readily contemplated by one of skill in the art, as wellas omit certain elements. For example, various other input devicesand/or output devices can be included in processing system 700,depending upon the particular implementation of the same, as readilyunderstood by one of ordinary skill in the art. For example, varioustypes of wireless and/or wired input and/or output devices can be used.Moreover, additional processors, controllers, memories, and so forth, invarious configurations can also be utilized as readily appreciated byone of ordinary skill in the art. These and other variations of theprocessing system 700 are readily contemplated by one of ordinary skillin the art given the teachings of the present principles providedherein.

Having described preferred embodiments of reducing dark current ingermanium photodiodes by electrical over-stress (which are intended tobe illustrative and not limiting), it is noted that modifications andvariations can be made by persons skilled in the art in light of theabove teachings. It is therefore to be understood that changes may bemade in the particular embodiments disclosed which are within the scopeof the invention as outlined by the appended claims. Having thusdescribed aspects of the invention, with the details and particularityrequired by the patent laws, what is claimed and desired protected byLetters Patent is set forth in the appended claims.

The invention claimed is:
 1. A method for reducing dark current in aphotodiode, comprising: heating a photodiode above room temperature;measuring the dark current generated by the photodiode; and applying areverse bias voltage to the heated photodiode to reduce a dark currentgenerated by the photodiode, increasing the reverse bias voltage untilthe measured dark current stabilizes to maximize a stable dark currentreduction after the photodiode returns to room temperature.
 2. Themethod of claim 1, wherein heating the photodiode comprises heating thephotodiode to about 175° C.
 3. The method of claim 1, wherein thephotodiode is formed from germanium above a silicon substrate.
 4. Themethod of claim 1, wherein heating the photodiode comprises one ofincreasing an ambient temperature and applying an on-chip heater.
 5. Acomputer readable storage medium comprising a computer readable programfor reducing dark current in a photodiode, wherein the computer readableprogram when executed on a computer causes the computer to perform thesteps of claim
 1. 6. A method for reducing dark current in a photodiode,comprising: heating a photodiode above room temperature; and applying areverse bias voltage to the heated photodiode to reduce a dark currentgenerated by the photodiode, increasing the reverse bias volatage untilreductions in dark current halt.
 7. The method of claim 6, furthercomprising measuring the dark current generated by the photodiode. 8.The method of claim 7, further comprising increasing the reverse biasvoltage until the measured dark current stabilizes to maximize a stabledark current reduction after the photodiode returns to room temperature.9. The method of claim 6, wherein heating the photodiode comprisesheating the photodiode to about 175° C.
 10. The method of claim 6,wherein the photodiode is formed from germanium above a siliconsubstrate.
 11. The method of claim 6, wherein heating the photodiodecomprises one of increasing an ambient temperature and applying anon-chip heater.
 12. A computer readable storage medium comprising acomputer readable program for reducing dark current in a photodiode,wherein the computer readable program when executed on a computer causesthe computer to perform the steps of claim 6.